Sandia’s “Cooler” technology offers fundamental breakthrough in heat transfer for microelectronics, other cooling applications

Sandia National Laboratories
July 7, 2011

Sandia National Laboratories has developed a new technology with the potential to dramatically alter the air-cooling landscape in computing and microelectronics, and lab officials are now seeking licensees in the electronics chip cooling field to license and commercialize the device.

The “Sandia Cooler,” also known as the “Air Bearing Heat Exchanger,” is a novel, proprietary air-cooling invention developed by Sandia researcher Jeff Koplow, who was recently selected by the National Academy of Engineering (NAE) to take part in the NAE’s 17th annual U.S. Frontiers of Engineering symposium.

Koplow said the Sandia Cooler technology, which is patent-pending, will significantly reduce the energy needed to cool the processor chips in data centers and large-scale computing environments. The yearly electricity bill paid by the information technology sector in the U.S. is currently on the order of seven billion dollars and continues to grow.

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